Copper molybdenum heat sink has high conductivity and a matched low thermal expansion.Copper molybdenum high performance composites are fabricated from carefully controlled porous Molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.
It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.
Copper molybdenum heat sink advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available
|Coefficient of Thermal Expansion
|Specific Heat Capacity
|Specific Electrical Resistance
To demonstrate the feasibility of this improved helium cooled tungsten diverter concept advanced net shape refractory metal forming techniques are being developed. Electrochemical forming techniques have been used to produce tungsten heat sinks that are 99% of the theoretical density of tungsten. Preliminary thermal response tests have demonstrated the ability of a tungsten heat sink with helium impingement cooling to reduce its average surface temperature by -20% as compared to the average surface temperature for a straight bore tungsten heat sink under the same heat flux.Molybdenum copper heat sink has good electricity conductivity. It is s suitable for aeronautic and astronautic applications and copper molybdenum heat sinks. We provide heat sinks for semiconductors and communications devices.