Copper Molybdenum Heat Sink

Copper Molybdenum Heat Sink Picture

Copper molybdenum heat sink has high conductivity and a matched low thermal expansion.Copper molybdenum high performance composites are fabricated from carefully controlled porous Molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.
It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.
Copper molybdenum heat sink advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available

Ingredients Name CAS Number % Weight
Molybdenum 7439-98-7 50-85
Copper 7440-50-8 15-50

Composition (Wt%) Mo 85% Cu 15% Mo 70%
Cu 30%
Mo 50%
Cu 50%
Density
(g/cm3)
10.0 9.6 9.4
Coefficient of Thermal Expansion
(10-6/K)
6.3 7.5 9.8
Thermal Conductivity
(W/mK)
160 190 245
Specific Heat Capacity
(J/kgK)
275 300 320
Young's Modulus
(Gpa)
275 220 170
Specific Electrical Resistance
(uΩm)
0.044 0.035 0.027
Vickers Hardness
(HV10)
235 175 145

To demonstrate the feasibility of this improved helium cooled tungsten diverter concept advanced net shape refractory metal forming techniques are being developed. Electrochemical forming techniques have been used to produce tungsten heat sinks that are 99% of the theoretical density of tungsten. Preliminary thermal response tests have demonstrated the ability of a tungsten heat sink with helium impingement cooling to reduce its average surface temperature by -20% as compared to the average surface temperature for a straight bore tungsten heat sink under the same heat flux.Molybdenum copper heat sink has good electricity conductivity. It is s suitable for aeronautic and astronautic applications and copper molybdenum heat sinks. We provide heat sinks for semiconductors and communications devices.

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